Synopsys and Ansys are now united, igniting innovation from silicon to systems
We’re excited to share some important news regarding the recent combination of Synopsys and Ansys. This is a significant development that will bring enhanced value to you, our valued customers and partners.
On July 17th, 2025, Synopsys announced the completion of its acquisition of Ansys, a transaction that combines leaders in silicon design, IP, and simulation and analysis to create the leader in engineering solutions from silicon to systems. Together, the companies will maximize the capabilities of engineering teams broadly, enabling them to rapidly innovate AI-powered products.
Now as ESSS, an Ansys, part of Synopsys, Apex Channel Partner, we’re proud to join a larger team dedicated to advancing engineering simulation and design across all sectors. Our commitment to customer success remains absolute. Our team stays focused on helping our customers innovate, reduce time-to-market and costs, and significantly improve product quality. The unprecedented insights expected from ESSS and Ansys will continue to be delivered.
Mario Sofia, ESSS’ CRO, states: “This strategic combination strengthens our ability to serve our customers. Our deep expertise with Ansys solutions, now complemented by Synopsys’ broader portfolio, means we’re better positioned than ever to help our customers drive groundbreaking innovation and achieve their engineering goals.”
As Synopsys President and CEO Sassine Ghazi puts it, “The increasing complexity of developing intelligent systems demands design solutions with a deeper integration of electronics and physics, enhanced by AI. With Ansys’ leading system simulation and analysis solutions now part of Synopsys, we can maximize the capabilities of engineering teams broadly, igniting their innovation from silicon to systems.”
A message from Synopsys President and CEO Sassine Ghazi
Igniting innovation from silicon to systems
The combination of capabilities will be game-changing, offering holistic engineering solutions that enable the next generation of AI-powered products. Synopsys and Ansys expect to deliver the first set of integrated capabilities — which will fuse multiphysics across the full EDA (Electronic Design Automation) stack, including multi-die advanced packaging — in the first half of 2026. The combined roadmap also includes integrated solutions to advance testing and virtualization of complex, intelligent systems for automotive and other industries.
Join us as we embark on this journey together with ESSS, Synopsys, and Ansys. By re-engineering how intelligent products are engineered, we will ignite innovation from silicon to systems and empower innovators everywhere to drive human advancement!
