Ansys LS-Dyna

Multiphysics Solver

Ansys LS-DYNA is the industry-leading explicit simulation software used for applications like drop tests, impact and penetration, smashes and crashes, occupant safety, and more.

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Simulate the Response of Materials to Short Periods of Severe Loading

Ansys LS-DYNA is the most used explicit simulation program in the world and is capable of simulating the response of materials to short periods of severe loading. Applications include:

Explosion / Penetration
Bird Strike
Crashworthiness / Airbag Simulations
Fracture
Splashing / Hydroplaning / Sloshing
Incompressible and Compressible Fluids
Stamping / Forming / Drawing / Forging
Biomedical and Medical Devices Simulations
Impacts
Product Misuse / Severe Loadings
Product Failure / Fragmentation
Large Plasticity in Mechanisms

Software Specs

LS-DYNA delivers a diverse array of analyses with extremely fast and efficient parallelization.

Impact Analysis

Forming Solutions

Euler, Lagrange, and ALE Formulations

Non-linear Implicit Structural Analysis

Crash Simulation and Analysis

Electromagnetics

Smoothed-Particle Hydrodynamics

Non-linear Explicit Structural Analysis

Failure Analysis

Fluid-structure interaction

Incompressible Fluid Dynamics

Total Human Model for Safety (THUMS™)

New features

Ansys LS-DYNA many elements, contact formulations, material models and other controls can be used to simulate complex models with control over all the details of the problem.

Incompressible Smooth Particle Hydrodynamics (IPSH)

ISPH innovations include a new utility tool to process SpaceClaim data, better visualization, the ability to record the time history of FSI forces, removal of volume-constrained resources (i.e., Gearbox analysis), heat transfer coefficient calculation for import to Mechanical and Fluent and SPH box fragmentation.

Battery Safety Workflow

Predict the combined structural, electrical, electrochemical, and thermal responses (EET) of automotive batteries following abuse with a new comprehensive battery safety workflow.

HPC and Performance Enhancements

Accelerate simulations with improved multithreading for acoustics (up to 2x faster vs. R13) to new variational BEM with low-rank matrix assembly and new ONE MPI packaging for easy migration from Platform MPI to Intel or Open MPI.

Multi-case Modeling in Workbench

Perform drop and impact analysis for multiple cases using a single model setup, allowing for quicker results for users to review and compare with significant improvements to meshing quality.

New Capabilities for High-Tech Electronics

New capabilities include solder reflow simulation, multiscale modeling, and Sherlock to LS-DYNA workflow.

Multiscale Co-simulation

Patent-pending technology offers LS-DYNA users to include mesoscale effects from joints with macro-scale structures to analyze the global structural response and simultaneously capture failure responses accurately at the mesoscale.

We are ready to understand and solve your engineering simulation challenges

Ask for a quote now: an ESSS expert will contact you to choose the best software for your needs and help you successfully tackle your challenges in engineering. Start now and become more competitive in the market.

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